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Topics to be Considered

The sixth IEEE CPMT International Conference on High Density Microsystem Design and Packaging and Failure Analysis will cover the following areas and objects: 

• High density design and packaging including micro- and nanosystems, microelectronics and opto-electronics design and packaging, CSP, BGA, Flip-chip, Chip on Board, Surface Mount Technology and other novel emerging technology
• High density substrate including integrated passives and active devices
• MEMS and MOEMS design, packaging and assembly
• Microsystems manufacturing issues including cleaning issues, quality control, logistics, repair, process optimization, statistic process controls, ISO compliance, tooling or equipment, early manufacturing involvement initiatives and yield and test innovations used to enhance manufacturing processes or products related to high density substrates, single chip and multichip packaging, chip bumping and integrated component technologies
• Component failure analysis techniques including non-destructive X-ray, ultrasonic microscopy, IR-microscopy etc
• Simulation and modelling for packaging and microsystems and microelectronics manufacturing processes
• Thermal management
• Environmental design and materials development including life cycle analysis and end of life strategy etc
• Cost reengineering, improvements and analysis for electronics packaging processes and products

Objectives and Scope

 Invited Talk

Topics to be Considered

The Program Committee

Final Programme

Training Courses

Registration

Accommodation

Tours

Exhibition

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