H D P '04
Welcome to Participate!
June 30-July 3,2004 Shanghai University, Shanghai, China

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The Sixth IEEE CPMT Conference on
High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04)


Announcement and Call for Papers

Organized by

SMIT Center, Shanghai University, Shanghai, China


Date: June 30 - July 3, 2004

Venue: Bao Long Hotel, No 180, Ye Xian Road, Shanghai

Co-sponsored by

SMIT Centre, Shanghai University, China

IEEE CPMT Society, USA

Shanghai Science and Technology Commission, Shanghai Government

Gothenburg City Government, Sweden

Chalmers University of Technology, Sweden

IVF Industrial Research and Development Corporation, Sweden

IEEE CPMT China Chapter

IEEE CPMT Scandinavian Chapter

National Natural Science Foundation of China

Hong Kong University of Science and Technology

Shanghai Jiaotong University, China

DaimlerChrysler SIM TECH, Shanghai, China.

Shanghai Institute of Microsystems and Information Technology, China

Objectives and Scope
Key Note Speech

Invited Talk

Topics to be Considered

The Program Committee

Final Programme

Training Courses

Registration

Accommodation

Tours

Exhibition

Download forms

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Contact: Mr Jack Yan or Dr Jianhua Zhang, SMIT Center,Shanghai University, 200072, China
Tel: +86-21-56331599, Fax: +86-21-56332054