The 7th IEEE CPMT International Academic Conference on Next Generation Microsystem Packaging Research and Education
Welcome to Participate!
June 28-30,2004 Shanghai University, Shanghai, China

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Topics to be Considered

The 7th International Academic Conference will have the following sessions: Research Sessions:

Research Sessions:

  • Key note talks
  • Invited talks
  • Microsystem Packaging Research in the China and the rest of the world.
  • MEMS integration and packaging technology
  • Photonics integration and packaging
  • Bio-chip integration and packaging
  • Nanointegration and packaging

Education Sessions:

  • Microelectronics integration and packaging graduate and undergraduate education programs and curricula
  • Pre-college and vocational programs/novel internship program
  • Workshop on web-based teaching

Training Sessions:

  • Continuing professional development programs
  • On-line tutorials and short courses
  • Technical management in microsystem integration and packaging

Objectives and Scope

Topics to be Considered

The Program Committee

Final  Programme

Registration

Accommodation

Tours

Download forms

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Contact: Mr Jack Yan or Dr Jianhua Zhang, SMIT Center,Shanghai University, 200072, China
Tel: +86-21-56331599, Fax: +86-21-56332054
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