PURPOSE OF THE CONFERENCE:

The purpose of the conference is to make the academic community aware of all the significant advances made worldwide in both next generation microsystem integration and packaging research and education. In addition one of the goals of this conference is to promote international collaborations in areas of mutual interest to serve the global technical community better.

SCOPE OF CONFERENCE:

The 7th International Academic Conference will be organized by Sino-Swedish Microsystem Integration Technology (SMIT) Center, Shanghai and held between June 28-30, 2004 at Shanghai University. This conference will be held in an area (Shanghai) where there is a fast growth of microsystem manufacturing and packaging industry. This conference will help to line up the academic and industrial community in Asia as well as in the rest of the world and strengthen its collaboration with the counterparts in Europe and USA. It is essential to make microsystem integration and packaging research, education and training a global focal point. The 7th International Academic Conference will have the following sessions:

Research Sessions:

• Key note talks
  
• Invited talks
  
• Microsystem Packaging Research in the China and the rest of the world.
  
• MEMS integration and packaging technology
  
• Photonics integration and packaging
  
• Bio-chip integration and packaging
  
• Nanointegration and packaging

Education Sessions:

• Microelectronics integration and packaging graduate and undergraduate education programs and curricula
  
• Pre-college and vocational programs/novel internship program
  
• Workshop on web-based teaching

Training Sessions:

• Continuing professional development programs
  
• On-line tutorials and short courses
  
• Technical management in microsystem integration and packaging