The Seventh IEEE CPMT International Academic Conference on
Next Generation Microsystem Packaging Research and Education
June 28-30, 2004

Shanghai University, Shanghai, China

Co-sponsored by

IEEE CPMT Society, USA

Shanghai Science and Technology Commission, Shanghai Government

Gothenburg City Government, Sweden

National Natural Science Foundation of China

Hong Kong University of Science and Technology

Chalmers University of Technology, Sweden

Shanghai University, China

IEEE CPMT Scandinavian Chapter

IEEE CPMT China Chapter

SMIT Centre, Shanghai University, China

Venue
Baoshan Campus, Shanghai University

(http://www.shu.edu.cn)

Shangda Road 99,Shanghai, China

View of Shanghai Pujiang	Shanghai University	Teaching Building